Engineering Services

Power Electronics
Solutions.

End-to-end power electronics engineering beyond motor and inverter development — design verification, physical design, package engineering, test engineering, and product engineering. Every deliverable built on the AI platform.

DVT
Design Verification
DFT
Design for Test
DFM
Design for Manufacturing
30–40%
NRE Cost Reduction
Service Areas

From first silicon to
production release.

Whether you need to verify an existing design, prepare it for manufacturing, or qualify it for a demanding application — Power Flux AI provides the full engineering stack.

Design Verification (DVT)

Verify Before You Build

Comprehensive design verification against electrical, thermal, and mechanical specifications. Simulation-based verification using PLECS, MATLAB, and FEMM before any prototype is fabricated — catching design errors at the lowest possible cost point.

PLECS / MATLABThermal FEAFEMMEMI Pre-Compliance
Design for Test (DFT)

Test Points, Not Surprises

Structured design-for-test methodology ensures every critical signal is accessible and measurable. Test point placement, boundary scan architecture, built-in self-test (BIST), and automated test pattern generation. Built into the design — not retrofitted.

Test Point DesignBISTBoundary ScanATE Integration
Physical Design

Layout That Performs

High-power multi-layer PCB physical design with EMI-controlled routing, power plane optimization, thermal relief, and creepage/clearance compliance. AI-assisted layout generation from validated schematics. KiCad-based with full DRC and LVS sign-off.

KiCadEMI-Controlled RoutingPower PlanesDRC / LVS
Package Engineering

Module and Enclosure

Power electronics packaging for demanding environments — thermal interface design, enclosure engineering, connector selection, IP rating compliance, potting and conformal coating specifications. Refrigerant-cooled and liquid-cooled packaging for high-density applications.

Thermal InterfaceIP RatingLiquid-CooledConformal Coat
Test Engineering

Automated Test Systems

End-of-line test fixture design, automated test sequence development, HIL-based functional test, power quality and efficiency characterization, and reliability test protocol development. dSPACE and Typhoon HIL integration for real-time DSP validation.

dSPACE HILTyphoon HILAutomated TestPower Analyzer
Product Engineering

From Prototype to Production

Full product engineering support from validated prototype to production release — BOM optimization, alternate sourcing, manufacturing process specification, first article inspection (FAI), and ongoing product sustaining engineering.

BOM OptimizationFAISustaining Eng.Supply Chain
The AI Advantage

Every service delivered
on the AI platform.

EMI Pre-Compliance
Before First PCB
AI-driven EMI prediction identifies emission issues in simulation before any hardware is fabricated. Formal certification becomes a confirmation, not a discovery. Reduces re-spin risk significantly.
30–40% BOM Cost
vs. Imports
India-based supply chain and AI-driven BOM optimization delivers 30–40% cost reduction versus European import pricing. 4-week lead times on validated platforms versus 12-week incumbent lead times.
Compliance Built In,
Not Bolted On
IEEE 519-2014, IEC 61000-3-12, UL 61800-5-1, SIL2 — automated compliance checking is embedded in the AI design workflow from the first iteration, not checked at the end of the project.
Modular Reuse
Across Projects
Every verified design block enters the IP-protected platform library. Subsequent projects that reuse verified blocks move faster and cost less — compounding advantage with every engagement.

Start with an Architecture Sprint.

Fixed scope, clear deliverables, 2–4 weeks. Technical evaluation of your design, proposed verification approach, and a clear roadmap to production sign-off.