Engineering Services

Mechanical Design
& 3D Modeling.

Full mechanical engineering from initial concept to production-ready drawings — 3D CAD, thermal-mechanical integration, refrigerant and liquid-cooled enclosure design, prototype fabrication, and complete production documentation. Every design integrated with the power electronics from day one.

3D CAD
FreeCAD · OpenSCAD
Thermal
CFD · FEA Integration
Cooling
Refrigerant · Liquid · Air
Prototype
Fabrication · Assembly

"The mechanical design is co-developed with the power electronics — not handed off at the end. Thermal management, cooling integration, and enclosure design are part of the architecture from day one. This is how footprint gets reduced and power density gets maximized."

Mechanical Capabilities

Integrated mechanical engineering.
From concept to production drawing.

3D CAD Design
FreeCADOpenSCADFreeCAD FEM
Full parametric 3D modeling in FreeCAD — open-source, no license cost. Power electronics enclosure design, heat sink geometry, bus bar routing, connector layouts, and mechanical interface definition. OpenSCAD for script-driven parametric geometry. Designed in tandem with PCB layout for precise fit and thermal coordination.
  • ›Parametric 3D modeling — change one dimension, everything updates
  • ›Full assembly with PCB, busbars, connectors, and cooling
  • ›Interference checking and tolerance stack-up analysis
  • ›Full 2D production drawings with GD&T callouts
Thermal-Mechanical Integration
CFDThermal FEA
Thermal management is engineered into the mechanical design, not retrofitted. Heat sink geometry optimized via CFD. Thermal interface material selection and compression specification. Junction-to-ambient thermal resistance analysis across full power range.
  • ›Heat sink geometry optimization via CFD simulation
  • ›Thermal interface material selection and specification
  • ›Junction temperature prediction across full operating envelope
  • ›Derating curves and thermal margin documentation
Refrigerant & Liquid Cooling
Refrigerant-CooledLiquid-Cooled
Power electronics packaging co-designed with the refrigeration circuit — a capability no incumbent currently offers. Refrigerant-cooled cold plates, liquid cooling manifold design, flow rate and pressure drop analysis, and sealing specification for HVAC and chiller integration environments.
  • ›Refrigerant-cooled cold plate design for SiC modules
  • ›Liquid cooling manifold with flow rate and pressure drop analysis
  • ›Seal design and leak test specification
  • ›Integration interface for chiller and HVAC OEM systems
Prototype Fabrication & Production Drawings
FabricationGD&T
From 3D model to fabricated prototype — supplier selection, drawing release, first article inspection (FAI), and assembly. Full production drawing package with GD&T callouts, material specifications, surface finish requirements, and manufacturing process notes.
  • ›Prototype fabrication coordination with qualified suppliers
  • ›First article inspection (FAI) against production drawings
  • ›Full GD&T dimensioned production drawings
  • ›Material and surface finish specification documentation

Integrate mechanical from day one.

The most costly mechanical mistakes happen when electronics and mechanics are designed separately. Start with an Architecture Sprint where both disciplines are scoped together.