Analysis &
Simulation.
GPU-accelerated full-system simulation — power stage, control loop, and grid model simultaneously. EMI pre-compliance prediction, thermal FEA, CFD cooling optimization, and digital twin construction. All before the first PCB is fabricated.
Verify in silicon.
Build with confidence.
Every simulation type is integrated into the AI design loop — results feed directly back into parameter optimization, closing the design cycle automatically.
Circuit Simulation
Full power stage simulation — switching transients, gate drive timing, snubber design, DC bus dynamics, film capacitor RMS current. PLECS and MATLAB for system-level, ngspice and LTSpice for component-level. Loss analysis across full operating envelope.
FEA — Motor & Magnetics
Open-source FEA using FEMM and Elmer FEM for motor electromagnetic analysis — flux density, torque, back-EMF, cogging, iron loss. Automated parameter sweeps via Python scripting. 3D electromagnetic analysis for complex geometries.
FEA & CFD Cooling
Thermal FEA for power module junction temperature prediction. CFD cooling optimization for liquid-cooled, refrigerant-cooled, and air-cooled heat exchanger design. Thermal network modeling for real-time digital twin deployment.
Full System & HIL
GPU-accelerated full-system simulation combining power stage, control loop, and grid model simultaneously. Hardware-in-the-loop (HIL) with dSPACE and Typhoon HIL for real-time DSP validation before hardware build. AI-FOC algorithm verification.
EMI & Harmonic Analysis
Automated IEEE 519-2014 harmonic compliance checking across the full load range. EMI pre-compliance prediction — conducted and radiated — before the first PCB fabrication. LCL filter design and optimization. THDi target verification in simulation.
Digital Twin & IoT
Physics-based digital twin constructed during the design phase and deployed with the production unit. Real-time monitoring via Python + InfluxDB + cloud IoT. Field data feeds back into the AI platform to improve future designs continuously.
Mechanical FEA
Structural and mechanical FEA of enclosures, heat sinks, bus bars, mounting brackets, and cooling manifolds. Static stress, modal analysis, fatigue life estimation, and vibration response. OpenFOAM CFD for fluid dynamics and cooling channel optimization. Ensures mechanical integrity before fabrication.
Enterprise capability.
Without the license cost.
The simulation platform eliminates six-figure annual software licensing costs that burden every incumbent. The tools are open source. The proprietary AI models, training datasets, and 35 years of design judgment layered on top are the value.
Get simulation results fast.
Many simulation engagements begin as standalone T&M projects — a specific FEA study, an EMI pre-compliance check, or a HIL validation run. Contact us to scope your requirement.